PublisherDOIYearVolumeIssuePageTitleAuthor(s)Link
Science Editing10.6087/kcse.78201632119-121International Society of Managing and Technical Editors’ Asian Conference 2016Hyun Jung Yihttp://www.escienceediting.org/upload/se-3-2-119.pdf, http://www.escienceediting.org/journal/view.php?doi=10.6087/kcse.78, http://www.escienceediting.org/upload/se-3-2-119.pdf
Science Editing10.6087/kcse.143201852159-1612018 Asian-Pacific Conference of the International Society of Managing and Technical EditorsYu-Jin Choihttp://escienceediting.org/upload/se-5-2-159.pdf, http://escienceediting.org/journal/view.php?doi=10.6087/kcse.143, http://www.escienceediting.org/upload/se-5-2-159.pdf
Science Editing10.6087/kcse.10520174298-100The Second Asian-Pacific Conference of the International Society of Managing and Technical EditorsSun-Im Ryuhttp://www.escienceediting.org/upload/se-4-2-98.pdf, http://www.escienceediting.org/journal/view.php?doi=10.6087/kcse.105, http://www.escienceediting.org/upload/se-4-2-98.pdf
Science Editing10.6087/kcse.6520163157-59Asian Science Editors' Conference and Workshop 2015Jae Hwa Changhttp://www.escienceediting.org/upload/se-3-1-57.pdf, http://www.escienceediting.org/journal/view.php?doi=10.6087/kcse.65, http://www.escienceediting.org/upload/se-3-1-57.pdf
10.1007/978-981-4560-61-02013Proceedings of the International Conference on Managing the Asian Centuryhttp://link.springer.com/content/pdf/10.1007/978-981-4560-61-0.pdf, http://link.springer.com/content/pdf/10.1007/978-981-4560-61-0
IOP Conference Series: Materials Science and Engineering10.1088/1757-899x/113/1/0110022016113011002Technical Editorshttp://stacks.iop.org/1757-899X/113/i=1/a=011002/pdf, http://stacks.iop.org/1757-899X/113/i=1/a=011002?key=crossref.011f89b7655c51bf7136a9992eb299c2, http://stacks.iop.org/1757-899X/113/i=1/a=011002/pdf
Science Editing10.6087/kcse.9020174143-45The 3rd Asian Science Editors’ Conference and Workshop 2016Jieun Hani Kimhttp://www.escienceediting.org/journal/view.php?doi=10.6087/kcse.90, http://www.escienceediting.org/upload/se-4-1-43.pdf, http://www.escienceediting.org/upload/se-4-1-43.pdf
2021 IEEE/ACM International Conference on Technical Debt (TechDebt)10.1109/techdebt52882.2021.000132021Experiences on Managing Technical Debt with Code Smells and AntiPatternsJacinto Ramirez Lahti, Antti-Pekka Tuovinen, Tommi Mikkonenhttp://xplorestaging.ieee.org/ielx7/9462944/9462954/09463036.pdf?arnumber=9463036
Proceedings of the 2018 International Conference on Technical Debt10.1145/3194164.31941792018A proposed sizing model for managing 3rd party code technical debtWill Snipes, Srini Ramaswamyhttps://dl.acm.org/doi/pdf/10.1145/3194164.3194179
IEEE Transactions on Aerospace and Electronic Systems10.1109/taes.2016.781290220165252605-2610Technical areas & editors: Aerospace and Electronic Systems Societyhttp://xplorestaging.ieee.org/ielx7/7/7812856/07812902.pdf?arnumber=7812902